Ultra-Low Profile

1U
Heatsink

Rapidaccu specializes in ultra-low profile 1U heatsinks engineered for maximum thermal performance within strict height constraints. Our advanced vapor chamber and copper base designs enable efficient cooling in the most space-limited server environments.

25mm
Max Height
200W
TDP Capacity
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1U Heatsink

1U Cooling Technologies

Advanced thermal solutions for extreme space constraints

Vapor Chamber

Ultra-thin two-phase heat spreaders distribute heat across entire base surface, ideal for high heat flux CPUs in 1U form factor

Copper Base

High-purity copper base plates with precision-machined fin arrays maximize surface area within 25-28mm height limits

Dense Fin Array

Optimized fin pitch and spacing balance thermal performance with air flow resistance for passive cooling scenarios

1U Heatsink Product Range

Comprehensive cooling solutions for 1U rack servers

LGA1700 1U Passive Cooler
180W TDP

LGA1700 Vapor Chamber

25.5mm height passive cooler with VC soaking plate, 78x78mm hole spacing

Passive VC Tech
All Copper 1U LGA2011
Copper

LGA2011 All Copper

Rectangular passive CPU cooler with pure copper construction for maximum thermal transfer

Passive 100% Cu
AMD AM5 1U Heatsink
AMD

AMD AM5 Desktop 1U

Low-profile cooler for AMD AM5 socket desktop and server platforms

AM5 AMD
1U LGA1700 VC Cooler
200W TDP

1U Server VC Cooler

All copper vapor chamber for LGA1700, fanless passive heat sink vaporizer

Fanless VC
AMD SP3 TR4 1U Active
Active

AMD SP3/TR4 1U Active

High-performance 1U active vapor chamber heatsink for AMD server processors

Active AMD
1U 26MM LGA1150/1151/1155/1156
26mm

LGA1150/1151/1200

26mm height passive cooler supporting multiple Intel desktop/workstation sockets

Multi-Socket 26mm
Copper 1U LGA2011 Narrow
Narrow

LGA2011 Narrow ILM

Copper 1U passive cooler designed for narrow ILM mounting configuration

Copper Narrow
LGA3647 1U Server Heatsink
Server

LGA3647 1U Cooler

High-quality server CPU cooler for Intel Xeon Scalable processors

Xeon 3647
Active 1U Turbo Blower
Turbo

1U Turbo Blower Active

Active copper heat sink with turbo blower fan for LGA1151/1155/1156

Blower Copper

1U Form Factor Advantages

1U rack servers maximize data center density, enabling more computing power per rack unit. Rapidaccu’s specialized 1U heatsinks overcome the thermal challenges inherent in ultra-compact server designs.

Maximum Density

Fit 42 servers in a standard 42U rack, optimizing floor space utilization and reducing data center footprint

Power Efficiency

Lower power consumption per compute unit with optimized thermal design enabling efficient processor operation

Cost Effective

Reduced cooling infrastructure costs and lower operating expenses through compact thermal management

25-28mm
Height Range
200W
Max TDP
Passive
Silent Operation
24/7
Reliability

Technical Specifications

Physical

Height Clearance
25mm – 28mm
Base Material
Copper / Aluminum
Fin Material
Aluminum 6063
Weight
200g – 600g

Thermal

TDP Support
120W – 200W
Thermal Resistance
0.15 – 0.25 °C/W
Base Flatness
≤0.05mm
Vapor Chamber
Optional

Compatibility

Intel Sockets
LGA1700/2011/3647
AMD Sockets
AM4/AM5/SP3/TR4
Mounting
Square/Narrow ILM
Rack Size
1U (44.45mm)

Frequently Asked Questions

Q: What is the maximum TDP a 1U heatsink can handle?

A: Passive 1U heatsinks typically handle 120-180W TDP with adequate airflow (1-2 m/s). Vapor chamber designs can reach 200W. Active coolers with integrated fans can support higher TDP but are limited by noise and fan reliability considerations.

Q: Why use vapor chamber technology in 1U heatsinks?

A: Vapor chambers provide superior heat spreading across the entire base surface, critical in 1U form factors where fin height is severely limited. This enables efficient heat dissipation from high heat flux processors to available fin surface area.

Q: What airflow requirements are needed for 1U passive cooling?

A: Minimum airflow of 1-2 m/s (200-400 LFM) is recommended for passive 1U heatsinks. Higher TDP configurations may require 2-3 m/s. Most 1U chassis provide 40mm or 60mm fans generating adequate airflow for passive heatsink operation.

Q: Can 1U heatsinks be used in desktop systems?

A: Yes, 1U heatsinks are ideal for low-profile desktop builds, mini-ITX systems, and compact workstations requiring minimal height clearance. Ensure adequate case airflow or consider active cooling variants for sustained high-load operation.

Q: What mounting systems are compatible with 1U heatsinks?

A: Our 1U heatsinks support Intel square/narrow ILM (Independent Loading Mechanism), backplate mounting, and AMD clip-based systems. Custom mounting brackets can be designed for proprietary server platforms requiring specific keep-out zones.

Q: What is the lead time for custom 1U heatsinks?

A: Standard designs typically ship within 2-3 weeks. Custom 1U heatsinks require 3-4 weeks for design validation and tooling, plus 4-6 weeks for production. Prototype samples can be provided for thermal testing before full production runs.

Get Your 1U Heatsink Quote

Contact Rapidaccu for custom 1U heatsink solutions. Our engineering team provides thermal analysis, design optimization, and competitive manufacturing for your ultra-low profile cooling needs.

Manufacturing Address
Rongli Industrial Park, Dalang, Longhua District, Shenzhen, China
Email Contact
info@rapidaccu.com
Industry Experience
15 Years in Precision Thermal Solutions

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