2U Heatsink
2U Server Cooling

2U
Heatsink

Rapidaccu’s 2U heatsinks deliver exceptional thermal performance for high-power server processors. Engineered for 200-400W TDP support with optimized heat pipe configurations and precision-machined fin arrays.

44mm
Height Space
400W
Max TDP
4-6
Heat Pipes
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2U Cooling Capabilities

Enhanced thermal capacity through increased height allowance and advanced heat dissipation technologies

Increased Height

44mm total clearance enables larger fin surface area and enhanced thermal performance compared to 1U designs

Heat Pipe Arrays

4-6 copper heat pipes efficiently transport heat from CPU die to extended fin arrays for maximum dissipation

High TDP Support

Designed for 200-400W processors including latest Intel Xeon and AMD EPYC high-core-count CPUs

Flexible Options

Available in passive and active configurations with custom mounting brackets for diverse server platforms

2U Heatsink Portfolio

Comprehensive cooling solutions for 2U rack servers and workstations

2U 3647 CPU Cooler
Active

LGA3647 4 Heat Pipe

2U height active cooler with 4-pipe configuration for server workstation cooling

2U Passive AM4/AM5
Passive

Quiet 2U AM4/AM5

Silent passive server CPU cooler for AMD Ryzen and EPYC platforms

High Performance 2U LGA3647
Active

LGA3647 Square Socket

High-performance 2U active CPU cooler for square socket configurations

2U Active FCLGA4189
400W TDP

FCLGA4189 5-Pipe

2U active server heatsink with 5 heating pipes, TDP 400W capability

2U Passive LGA3647
Passive

Excellent 2U Passive

Square LGA3647 2U passive server CPU cooler for silent operation

2U Server Desk Active
PWM Fan

12V 4-Pin PWM

Desktop 2U server heatsink with PWM-controlled cooling fan

2U Narrow LGA3647
Narrow ILM

Factory 2U Narrow

LGA3647 narrow active heatsink for server CPU cooling applications

Quiet 2U Passive
Silent

Quiet 2U Passive

Ultra-quiet passive cooling for noise-sensitive server environments

2U AMD SP5 Active
380W TDP

AMD SP5 6-Pipe

2U active cooler with 6 copper heating pipes, 380W TDP, PWM fan

Technical Excellence

Precision Engineering for 2U Systems

Rapidaccu’s 2U heatsinks are meticulously engineered to maximize thermal performance within 44.45mm rack unit constraints. Our designs balance heat dissipation capacity, airflow resistance, and mounting compatibility.

Optimized Fin Design

Computational fluid dynamics (CFD) simulation ensures optimal fin pitch, spacing, and height for maximum heat transfer

Premium Materials

High-purity copper heat pipes, aluminum 6063 fins, and nickel-plated copper bases ensure superior thermal conductivity

Precision Manufacturing

CNC machining and automated assembly ensure dimensional accuracy and consistent quality across production volumes

44mm
Total Height
2U rack standard
6mm
Heat Pipe Dia.
Copper sintered wick
0.1°C
Thermal Res.
Per watt (typical)
±0.05
Flatness mm
Base plate precision

Platform Compatibility

Supporting current and legacy server processor sockets

Intel Xeon Platforms

LGA3647 – Xeon Scalable (Skylake, Cascade Lake, Cooper Lake)
LGA4189 – 3rd Gen Xeon Scalable (Ice Lake)
LGA4677 – 4th/5th Gen Xeon Scalable (Sapphire Rapids)
LGA2011 – Legacy Xeon E5/E7 platforms

AMD EPYC Platforms

SP3 – EPYC 7001/7002/7003 series (Naples, Rome, Milan)
SP5 – EPYC 9004 series (Genoa, Bergamo)
TR4/sTRX4 – Threadripper workstation processors
AM4/AM5 – Ryzen server and desktop platforms

Frequently Asked Questions

What TDP range can 2U heatsinks handle?

2U heatsinks typically support 200-400W TDP depending on configuration. Passive designs handle 200-250W with adequate airflow (2-3 m/s). Active coolers with integrated fans can manage 300-400W for high-performance server processors.

How many heat pipes are optimal for 2U designs?

Most 2U heatsinks utilize 4-6 heat pipes. Four pipes are sufficient for 200-250W TDP, five pipes for 300W, and six pipes for 350-400W applications. Heat pipe quantity must be balanced with fin density and airflow characteristics.

What is the difference between square and narrow ILM mounting?

Square ILM (78x78mm or 94x94mm) is used for most dual-socket servers with standard spacing. Narrow ILM (56x94mm) accommodates dense motherboard layouts with closer socket spacing. Mounting hole patterns differ between configurations.

Can 2U heatsinks be used in 3U or 4U chassis?

Yes, 2U heatsinks work in larger chassis but may not fully utilize available height. However, 2U designs often provide sufficient cooling for processors under 300W TDP even in taller enclosures, offering cost-effective solutions.

What airflow is required for passive 2U heatsinks?

Passive 2U heatsinks require minimum 2 m/s (400 LFM) airflow for 200W TDP. Higher power processors need 2.5-3 m/s (500-600 LFM). Most 2U chassis provide 60mm or 80mm fans delivering adequate airflow for passive cooling operation.

Do you provide custom 2U heatsink design services?

Yes, Rapidaccu offers complete custom thermal design including CFD simulation, heat pipe configuration optimization, and custom mounting brackets. Provide your thermal specifications, chassis dimensions, and component keep-out zones for tailored solutions.

Request 2U Heatsink Quote

Contact Rapidaccu for professional 2U server cooling solutions. Our thermal engineering team provides design consultation, performance simulation, and competitive manufacturing quotes.

Factory Location
Rongli Industrial Park, Dalang, Longhua District
Shenzhen, China
Email Address
info@rapidaccu.com
Experience
15 Years of Precision Manufacturing & Thermal Solutions

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