CPU
Heat Sink

Key factors include base material thermal conductivity, fin surface area, heat pipe configuration, contact pressure, and airflow velocity. Our engineering team optimizes these parameters for your specific CPU and thermal requirements.

Copper offers 80% higher thermal conductivity than aluminum but weighs more and costs more. We often use copper bases with aluminum fins to balance performance, weight, and cost. Pure copper is recommended for high-heat-flux applications.

We support all major Intel sockets (LGA115x, 1200, 1700, 2011, 3647, 4189) and AMD sockets (AM4, AM5, TR4, SP3, SP5). Custom mounting brackets can be designed for proprietary platforms or legacy systems.

Yes, Rapidaccu specializes in custom thermal solutions. Provide your CPU specifications, TDP, space constraints, and thermal requirements. Our team will design, simulate, and manufacture optimized cooling solutions tailored to your needs.

High-performance thermal paste (4-8 W/mK) is recommended for most applications. For automated assembly, thermal pads or phase change materials offer consistent performance. We can recommend specific TIM based on your assembly process and performance goals.

MOQ varies by design complexity. Standard designs typically require 100-500 units. Custom designs may need 500-1000 units to offset tooling costs. We provide prototype samples for testing before production orders.