Server
Heat Sink

We support all current Intel server sockets (LGA3647, LGA4189, LGA4677, LGA4710) and AMD server sockets (SP3, SP5, TR4). Both square and narrow ILM mounting configurations are available depending on the platform.

Passive cooling is suitable for TDP up to 150-200W with adequate chassis airflow. Active cooling with integrated fans is recommended for higher TDP processors (250W+) or servers with restricted airflow. We can help size the appropriate solution based on your thermal requirements.

1U heat sinks are limited to approximately 26mm height and typically handle 150-200W TDP with vapor chamber or dense fin arrays. 2U heat sinks allow 44mm height, enabling better thermal performance (200-400W TDP) with larger fin surface area and heat pipes.

Yes, we provide custom design services to match specific server chassis dimensions, airflow patterns, and component keep-out zones. Provide your mechanical requirements and thermal specifications, and our engineering team will develop an optimized cooling solution.

For server applications, we recommend high-performance thermal paste (5-8 W/mK) for passive coolers or thermal pads (3-6 W/mK) for active coolers with mounting pressure variance. Phase change materials are suitable for automated assembly lines requiring consistent application.

MOQ depends on design complexity and customization level. Standard designs typically require 50-100 units minimum. Custom designs may require 200-500 units to offset tooling costs. We can provide prototype samples for testing and validation before production orders.