SMT/SMD Pogo Pin Connector Manufacturing

SMT (Surface Mount Technology) pogo pin connectors are soldered directly onto the surface of a PCB using reflow soldering, while through-hole connectors have leads that pass through holes in the PCB. SMT connectors are ideal for automated assembly, require less PCB space, and are suitable for high-volume production. Through-hole connectors provide stronger mechanical retention and are better for applications requiring high reliability or frequent mating cycles.

Yes, our SMT pogo pin connectors are specifically designed to withstand standard reflow soldering temperatures (up to 260°C peak). The internal spring mechanism and materials are engineered to maintain their characteristics after exposure to reflow profil es. We recommend following IPC-7351 guidelines for PCB pad design and using proper reflow profiles to ensure optimal results and long-term reliability.

PCB pad design is critical for reliable SMT assembly. We recommend rectangular pads sized 20-30% larger than the connector footprint to accommodate placement tolerances. The mating pad should be flat with ENIG or hard gold finish. Solder mask should be pulled back 0.1mm from pad edges. We provide detailed PCB design guidelines including pad dimensions, spacing requirements, and stencil aperture recommendations for each product.

Current ratings for SMT pogo pin connectors typically range from 1A to 3A per pin, depending on the pin diameter, contact area, and plating. Signal applications usually require lower current (< 1A), while power applications can handle 2-3A with proper thermal management. Gold plating provides the best conductivity and lowest contact resistance. For applications requiring higher current, we can design custom connectors with larger contact areas or recommend alternative mounting methods.